Overview

Being mass-production plentiful IC products cross computing, communication and consumer application, SiS has come out a set of production-proven procedures for design to meet time-to-market target. SiS turnkey service team provides adaptable turnkey services to customers, service options include package/substrate service, testing service, reliability/qualification service and production service based on either die or chip. High-speed serial bus like PCI Express, USB, SATA, and HDMI could be effective interconnection, nevertheless giga hertz switching signals potentially induced many effects, signal integrity is one of those issues needed to be considered in various design phases. SiS has an unique package & substrate service team experienced in high-speed design and analysis to assist our customers to realize cost-effective high-speed solutions. Our DFT experts, test program development team together with in-house Agilent 93000 series SoC high-speed test platform facilitate our customers ramp up the speed to mass-production.

Our Turnkey Services includes production engineering, IP cores, package/substrate engineering, test engineering, physical implementation & shuttle service. Of course, we can do things other than listed here, for example, porting IP, substrate design, layout service etc, as long as the price is right. A successful SoC Turnkey Services need both parties collaboration, therefore, the center of this slide shows a teamwork chart.