Testing Service
Testing service flow
SiS owns out a set of production-proven procedures for time-to-market target for mass-production
of plentiful customers’ products. SiS turnkey service team provides adaptable turnkey services to
customers, and service options include package/substrate service, reliability/qualification service,
and production service based on either chips or dies. Although high speed serial bus like PCI Express,
USB, SATA, and HDMI could be effective interconnection, giga hertz switching signals potentially
induces many unwanted effects. For these unavoidable effects, signal integrity is one of those issues
needed to be considered in various design phases. SiS has a unique package & substrate service team
who experienced in high speed design and analysis, and they are well-qualified to assist our customers
to realize cost-efficient high speed solutions. Our DFT experts and test program development team,
together with high-speed test platform facilitate, will help our customers to speed up the mass-production.
Testing environment
Test mode requirement is initiated in design phase (DFT)
- Core logic & SRAM low yield diagnosis & improvement
- Giga-bit SerDes I/O low yield diagnosis & improvement
In-house Verigy 93K testers
- 93K are available since 2003. It enhances test engineering
services
and capabilities in both wafer level and package level.
Testing Service experience
Our test engineers have test many different ICs.For high-speed interface & mixed-signal test. The chart below high speed is a shmoo plot
High-Speed Interface
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USB 2.0 (480Mb/s)
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SATA I / II (1.5 / 3.0Gb/s)
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PCIE 1.0 (2.5Gb/s)
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HDMI 1.2 (1.65Gb/s)
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LVDS (1.15Gb/s)
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DDR/DDRII (800Mhz)
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GTL (1066Mhz)
Mixed-Signal Test
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802.11a/b/g baseband
–up to 10bits and 40Msps ADC/DAC
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CVBS & S-Video ADC
–up to 10bits and 25Msps ADC
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VGA DAC (R/G/B)
–up to 8bits and 200Msps