Package Service
Complete package solution
SiS package/substrate service team has entire experience in
high speed design and analysis to assist the customers to realize
cost-efficient high speed solutions. The package services could
meet the different requirements of customers. SiS provides the
reliability and various failure analysis methods/reports to
customers by choosing the suitable package type based on electrical
and thermal simulation results. Furthermore, SiS also provides
yield improvement, PKG BOM suggestion, and time-to-market mass production services.
Package Type
Package/Substrate Patents
SiS has acquired more than 70 patents in the package/substrate aspect,
and the patent number keeps increasing.
